Addressing AI Server Manufacturing Challenges   (TAIPEI, Taiwan – April 20, 2026) –As the global demand for AI servers continues to surge, Electronic Manufacturing Services (EMS) providers are facing challenges in upgrading their production lines. Handling and assembling large-format, high-value PCBA (Printed Circuit Board Assemblies) now requires exacting standards of precision and yield. At the recently concluded “2026 Electronics Manufacturing Forum,” SUNSDA, in collaboration with UR, presented the “Large-Size PCBA Precision Pick-and-Place Solution,” practically addressing current technical bottlenecks in smart manufacturing and drawing attention from industry professionals….

Beyond Hardware: SUNSDA & Sunjsong Redefines AI Server PCBA Integration at UR Forum (TAIPEI, Taiwan – April 16, 2026) –In the competitive EMS landscape, the challenge of upgrading production lines lies in the “last mile” of integration. For high-value AI Server PCBAs—characterized by large dimensions and complex structures—standard handling is no longer sufficient. Sunjsong, a leader in System Integration (SI), is honored to speak at the Universal Robots (UR) Electronics Manufacturing Collaborative Automation Forum on April 23. We will demonstrate how professional SI transforms a UR cobot into…

Nepcon Korea 2026 Concludes Successfully: SUNSDA Showcases Cross-Domain SMT Integration (Seoul, April 14, 2026) Nepcon Korea 2026, a highly anticipated event for the global manufacturing industry, successfully concluded last Friday at the Coex Exhibition Center in Seoul. Throughout the multi-day event, SUNSDA engaged in profound technical exchanges with industry leaders at the GEA (Global Electronics Association) pavilion, collectively witnessing the powerful momentum driving the digital transformation of smart factories. The enthusiastic response at the exhibition reaffirmed a critical industry trend: while most hardware vendors specialize in single-point equipment,…

(April 10, 2026, Taipei Nangang) – If you are still struggling with high customization I/O integration costs and unexpected downtime caused by incorrect board transfers, seize the final chance at the 2026 Touch Taiwan exhibition. Join our team at the Sunjsong x GEA IPC joint booth, N326, in Taipei Nangang Exhibition Center, Hall 1, 4F, to explore your production line upgrade roadmap. During these past few days at the event, the most frequent feedback we received from industry advanced partners was: “Cross-equipment data integration can be this…

Live from Nepcon Korea: Technical Session Decodes the Key to SMT Equipment Integration (Seoul, April 7, 2026) As the Nepcon Korea 2026 exhibition progresses, technical exchanges and industry dialogues on the floor have deepened. During a technical sharing session at the GEA (Global Electronics Association) pavilion, the speaker utilized a comprehensive IPC-CFX Ecosystem Matrix to provide manufacturing decision-makers with an in-depth analysis of the current standardization landscape. A closer observation of the official matrix displayed by the speaker reveals a critical industry reality: while most vendors…